via:https://smtnet.com/news/index.cfm?fuseaction=view_news&company_id=41047&news_id=20573
Carson City, NV – Plasma Etch Inc, a leader in plasma treatment, rolled out the company’s patented gasless etching technology on the Mark II line of plasma etchers over the past year.
The patented gasless technology, originally developed for larger systems, has been condensed and allows the Mark II to offer unmatched speed and uniformity.
Since the release of the gasless technology, sales of the Mark II system have soared. The gasless Mark II is able to perform desmear and etch back without the added expense and environmental impact of CF4 gas. The system uses only electricity and oxygen.
This system is very popular with PCB manufacturers. Not only can you etch and desmear without CF4 gas, but customers have reported the gasless Mark II etching faster and more uniformly than a standard Mark II running CF4.
The company expects this growth to continue through 2018.
KeyWords Tag:PCB assembly process
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